听说PCI总线要被淘汰了！

我们还在这里探讨PCI接口的设计，是不是也落伍了？

毕竟PCI总线目前还是主流，而且还至少能撑个5~6年，再说其实新的总线出来了，开发思路还是差不多的。

The Third Generation I/O Advantage
• PCI has been adopted widely in the past decade as a general-purpose I/O interconnect standard
in multiple industry segments (desktop, mobile, server and communications).
• However, from a technical and cost perspective, the demands of emerging and future computing
models will exceed the capabilities of the traditional parallel bus architectures.
• Third Generation I/O architecture is a high-speed, serial I/O interconnect which is being developed
to address the needs of multiple market segments.
• Third Generation I/O architecture comprehends a broad range of computing and communications
target applications, emphasizing performance, cost, scalability, feature extensibility and missioncritical
reliability.
• Third Generation I/O is defined to be compatible with current PCI enumeration and software device
driver model.
An I/O Architecture for the Future
During the past decade, PCI has been a very successful, general-purpose I/O interconnect standard.
However, demands of emerging and future computing models will exceed the bandwidth and scalability
limits that are inherent in multi-drop, parallel bus implementations. Technologies such as
CPU speeds that will exceed 10 GHz, faster memory speeds, higher-speed graphics, 1 Gigabit and
10 Gigabit LAN, 1394b, InfiniBand* fabrics and others will drive the need for much greater internal
system bandwidth.
The time is right to start the move to a Third
Generation, general-purpose I/O interconnect,
one that can consolidate all the application
requirements and be used by multiple market
segments. Such a technology would seamlessly
complement PCI and transition the market
over the next several years.
A System with Third Generation I/O
Technology Delivers
Third Generation I/O is this next step in the
evolution of I/O architecture. Not only will it
work with and improve today’s PCI infrastructure,
it will allow system and communication
designers to use new topologies.
CPU
Graphics Memory
Gb
Ethernet
Mobile
Docking
ATA
Serial
3GIO
3GIO
3GIO
3GIO
Memory
Bridge
USB 2.0
PCI
HDD
Local I/O
Add Ins
I/O
Bridge
Switch
Why Build Products Based
on Third Generation I/O Architecture?
ROHIT CHHABRA, INTEL COMMUNICATION GROUP, INTEL CORPORATION
General-purpose desktop/mobile I/O interconnect
for 2003 and beyond
The networking communications platform could
use multiple switches for increased connectivity.
It, too, would benefit from a multiple chassis
implementation that could be constructed as a
modular I/O system.
Some of the key features of Third Generation I/O
technology are the following.
• Compatible with current PCI enumeration and
software device driver model.
• Layered architecture enabling physical layer
attachment to copper, optical, or emerging
physical signaling media to allow for future
encoding schemes.
• Maximum bandwidth per pin for enabling
unique and small form factors, reducing cost,
simplifying board design and routing, and
reducing signal integrity issues.
• Embedded clocking scheme enables superior
frequency scalability vs. source synchronous
clocking.
• Bandwidth scalability with frequency and/or
interconnect width.
• Predictable low latency suitable for applications
requiring isochronous data delivery.
• Quality of Service attributes.
• Hot Plug and Hot Swap capability.
• Power Management capabilities.
Why build products based on Third Generation
I/O architecture? Because Third Generation I/O
architecture will be a high performance, highly
flexible, scalable, reliable, stable and cost
effective general purpose I/O architecture that
is the natural evolution of PCI.
developer.intel.com/technology/3gio
SATA
USB2
LPC
Memory
GbE 3GIO
InfiniBand*
IBA
CPU CPU
PCI-X
3GIO
PCI
Bridge Bridge
Chipset
InfiniBand*
Switch Fabric
Third Generation I/O-based Server/Workstation System
These materials are provided “as is” with no warranties whatsoever, including any warranty of merchantability, noninfringement, fitness for any particular
purpose, or any warranty otherwise arising out of any proposal, specification or sample.
The Arapahoe Promoters disclaims all liability, including liability for infringement of any proprietary rights, relating to use of information contained herein. No
license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted herein. The information contained herein is preliminary and
subject to change without notice.
Copyright ? 2001, Compaq Computer Corporation, Dell Computer Corporation, Intel Corporation, International Business Machines Corporation,
Microsoft Corporation.
*Other names and brands may be claimed as the property of others.
Memory
Memory
GbE 3GIO
Bridge 3GIO x 8
3GIO x 8
CPU CPU
Chipset
Switch
Line Card Line Card Line Card Line Card Line Card
Third Generation I/O-based Networking
Communications System

Tom.Cat您好！
  请教您一个问题：LapLink电缆线是连接并口的线吗？谢谢您给我回答。

咱们不从事总线的定义、开发而只是使用它。只能是那种总线普及就用那种。其它考虑不了太多。

PCI总线存在的工业基础并没有多少变化，应该能再用 N 年吧！

恐怕没那么快,新的总线会出来,可PCI也不会马上消亡.想想ISA是什么时候的事了,可现在还在用.不要说你的机器里没有就没有人用了,在工控领域,ISA还是站有很大分额的.为什么么,协议简单,实现容易,性能又能满足要求的情况下,为什么不用?PCI也是这样,再过N年,我们还是对PCI 的熟悉就跟对ISA 一样,实现起来非常EASY,为什么不用呢?场合有变化而已呀.

唯一的不变是变化。

PCI总线的确要被淘汰了，而且比大家想象要快。据我所知，使用最新总线的体系最快今年就会出现。当然，大家不要伤心，新的技术每天都会出现，PCI被淘汰是早晚的事。 ;)

腠然

学了这么多年马列主义毛泽东思想其实关键就是一个方法论。
ISA转到PCI障碍就是考虑问题的方法不同，一旦成功了，再由PCI转到其他总线就简单多了。

我来回答“LapLink电缆线”的问题。
LapLink软件同时支持串口和并口线，不过推荐用并口，因为快。

代替pci的是什么哪？请解答

这是真的吗